Understanding and limiting  electromigration in thin films is essential to the continued development  of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.  Part one consists of three introductory chapters, covering modeling  of electromigration phenomena, modeling electromigration using the  peridynamics approach and simulation and x-ray microbeam studies of  electromigration. Part two deals with electromigration issues in copper  interconnects, including x-ray microbeam analysis, voiding,  microstructural evolution and electromigration failure. Finally, part  three covers electromigration in solder, with chapters discussing topics  such as electromigration-induced microstructural evolution and  electromigration in flip-chip solder joints.

Electromigration in Thin Films and Electronic Devices: Materials and Reliability PDF

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