The Industry Standard Guide to Wire Bonding--Fully Updated        The definitive resource on the critical process of connecting semiconductors with their packages.  Wire Bonding in Microelectronics , Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.        COVERAGE INCLUDES:     Ultrasonic bonding systems and technologies, including high-frequency systems    Bonding wire metallurgy and characteristics, including copper wire    Wire bond testing    Gold-aluminum intermetallic compounds and other interface reactions    Gold and nickel-based bond pad plating materials and problems    Cleaning to improve bondability and reliability    Mechanical problems in wire bonding    High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds    Copper, low-dielectric-constant (Cu/Lo-k) technology and problems     Wire bonding process modeling and simulation        CD includes all of the book's full-color figures plus animations.

WIRE BONDING IN MICROELECTRONICS, 3/E PDF

The list of books you might like